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The new 300-mm wafer fabrication plant will help support the future growth of semiconductors in electronics. Called RFAB2, the new "fab" is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab. Inside, 15 miles of automated, overhead delivery systems will eventually move wafers between the two fabs. At full production, the Richardson fabs will manufacture more than 100 million analog chips a day that will go into electronics everywhere, TI says.
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